PRINTED CIRCUIT BOARD CAPACITY
Category |
Description |
Capability |
File Formats |
Gerber files- preferred |
274-X,274-D,DPF,ODB++ |
Drill file |
X & Y coordinates, with tool sizes included |
|
Laminate Materials |
CEM1, CEM3, FR1, FR4(High TG, halogen-free), ISOLA(FR408,370HR), TEFLON, POLYIMIDE, ROGERS(RO4003,RO4350,RO4450),Aluminum plate (Single, Double-sided) |
|
Layer count |
Layer count |
1-26 layer |
Board dimensions |
Max. finished board dimensions |
39.37"x23.6" (1000mm*600mm) |
Tolerance of finished board dimensions |
±0.15mm |
|
Board Thickness |
Finished board thickness |
0.2-4.0mm |
Tolerance of finished board thickness |
Thickness <1.0mm: ±12% |
|
1.0mm ≤ Thickness <2.0mm: ±8%; ±10% |
||
Thickness ≥2.0mm: ±10% |
||
Warp and twist |
≤0.5% |
|
Copper |
Outer Cu thickness |
0.5oz ~ 7oz |
Inner Cu thickness |
0.5oz ~ 5oz |
|
PTH hole copper thickness |
0.4-2mil (10-50um) |
|
Drilling |
Min. diamension of drilled hole |
3mil (0.075mm) |
Min. drilling diameter |
1.5mm |
|
Drill Deviation |
±0.002” (0.050mm) |
|
PTH hole tolerance |
±0.003” (0.075mm) |
|
NPTH hole tolerance |
±0.002” (0.050mm) |
|
Min. half hole dimension |
0.6mm |
|
Tolerance of drilled slot |
±3mil (±75um) |
|
Plating |
Max aspect ratio of PTH |
10:01 |
Max. solder mask plug hole diameter |
0.8mm |
|
Max gold thickness of gold finger |
60u" (1.5um) |
|
Max nickel thickness of gold finger |
280u" (7um) |
|
Etching |
Trace width tolerance |
±20% |
Min. trace width / space (1oz finished Cu thickness starting from 1/3oz) |
0.003”/ 0.003”(0.08mm) |
|
Min. trace width / space (1oz finished Cu thickness starting from 1/2oz) |
0.004”/ 0.004”(0.1mm) |
|
Min. trace width / space (2oz finished Cu thickness) |
0.005”/ 0.005”(0.127mm) |
|
Min. trace width / space (3oz finished Cu thickness) |
0.008”/ 0.008”(0.2mm) |
|
Min. trace width / space (4oz finished Cu thickness) |
0.012”/ 0.012” (0.3mm) |
|
Inner Layers |
Min. space from drilling to inner pattern |
0.1mm |
Min. space from annular ring to inner pattern |
0.1mm |
|
Layer-to-layer registration |
±3mil(76um) |
|
Solder Mask |
Color |
green, white, black, yellow, red, blue |
Min. solder mask clearance |
0.003” |
|
Thickness |
0.0004” |
|
Silkscreen |
Color |
White, black, yellow, red, blue, green |
Electrical Test |
AOI |
Y |
Flying Probe Tester |
Y |
|
Controlled Impedance |
Tolerance |
±10% |
Impedance tester |
Tektronix TDS8200 |
|
Routing |
End Mills Test |
±0.15mm(0.006”) |
CNC Tolerance |
±0.15mm(0.006”) |
|
V-Cut Depth |
±0.1mm(0.004”) |
|
V-cut angle deviation |
±0.1mm(0.004”) |
|
Semi-hole |
Y |
|
Surface Finish |
HASL,HASL lead free, immersion gold, immersion silver, immersion tin, O.S.P (Entek),plating gold, carbon ink |
|
Blind and Buried Vias |
3+N+3 |
Y |
Resin,hole-filling ink,PTH |
Y |
|
Others |
UL Cert. |
Y |
ISO Cert. |
ISO9001/ISO14001/RoHS |